SiC Seed Wafers

Diameter	150.25±0.2mm 200.25±0.2mm
Thickness	500±25μm
Resistivity	0.015~0.025ohm·cm
Micro-pipe Density	≤0.5ea/cm2
LTV	≤3μm(5mm*5mm)
TTV	≤5μm
Bow	-15~15μm
Warp	≤20μm
Roughness	≤0.2nm（5μm*5μm）

 

Packaging: unit-ingot cassette/vacuum packaging.

 

*Research & Dummy Grade is also available. Please consult to our sales.